SensArray Process Probe 2055 instrumented glass chips allow you to configure a solution for reliable in situ characterization of glass temperature profiles in many flat panel processing applications. This flexible temperature measurement tool consists of a number of glass chips instrumented with TC sensors and bundled together with a flat cable and connector. You can easily attach the instrumented chips at desired locations on a panel of glass, offering a wide variety of configurations. This flexible product design makes temperature measurements for large-generation glass panel applications easy, and reduces the associated handling issues and high shipping costs. It also provides options for spare sensors should a field repair of the product be necessary.

The patented bonding method used to attach the glass chips of the Process Probe 2055 to your glass panel ensures a strong bond at high temperatures, and provides protection for wires and sensors. Once attached to a glass panel, the Process Probe 2055 performs with the same high accuracy and reliability as other SensArray instrumented substrates.

A versatile tool, the Process Probe 2055 allows you to choose:

• The number of sensors – from 1 to 34 – including spares
• The type of lead insulation – braided silica or quartz microtubing over 450°C
• The method for bonding the glass chips to the panel at your site – either permanent of detachable (type D)