Innovation Beyond the Chip: Exploring Advanced Packaging Architectures
For decades, the semiconductor industry relied on Moore’s Law—the idea that the number of transistors on a chip doubles roughly...
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Insights from the minds of innovators
PWG5™: The Complete Wafer Geometry System for IC Fabs
3D NAND memory is pervasive in today’s electronics – mobile devices, laptops, data centers, automobiles, and USB drives are...
Surfscan<sup>®</sup> SP7<sup>XP</sup>: Detecting Defects Drives Pristine Processes
Today, KLA Corporation announced our new Surfscan® SP7XP wafer defect inspection system. This new member of our Surfscan family...
New Orbotech Solutions Enable Next-Gen Electronics
As 5G smartphones, advanced automotive electronics, medical and WFH/LFH (learn-from-home) devices become lighter in weight, smaller in form factor...
Virtually Tour KLA's Ann Arbor Headquarters
Every year, Ann Arbor SPARK organizes a series of tech-related events in the Ann Arbor region called a2Tech360. KLA...
Meet KLA Instruments
Earlier this year we launched KLA Instruments, bringing together many of our product lines in the surface metrology space....
KLA Announces Third Quarter Earnings
Check out the infographic below to see some of KLA’s key financial information from the 2020 September Quarter, as...
KLA Welcomes New Chief Legal Officer
KLA is proud to announce the appointment of MaryBeth Wilkinson as our new executive vice president, chief legal officer...
New Packaging Products Drive Innovation
Enjoy the previously unreleased interviews with KLA’s engineering teams below! The original post follows. Today, KLA Corporation announced the...
A KlearView™ of All Reticle Data
Complex, high-volume semiconductor manufacturing processes require advanced optical and EUV reticles. These reticles must be error-free, as reticle defects...